Description
Special Request:
VIA holes with diameters of 0.25 and 0.35mm
need to copper cap Plating of resin filled Holes
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 61.50*26.50
Min. W/S(mil): 7.87/5.9
Min. Hole Size: 0.25mm