Description
Special Request:
1. IPC-600G Class 3;
2. Solder Mask Thickness: Min. 8um, Max. 30um.
Layer: 2L
Base Material: FR4 TG150 KB6165F
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin
Unit Size(mm): 280.00*210.00
Min. W/S(mil): 11.8/7.9
Min. Hole Size: 0.3mm