Description
Special Request:
1. BGA
2. Impedance Control
Layer: 8L
Base Material: FR4 TG150
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 36.57*51.88
Min. W/S(mil): 3.5/4
Min. Hole Size: 0.2mm
Solder Mask: Blue