Description
Special Request:
1. Impedance Control PCB
4 groups of single impedance control,
4 groups of differential impedance control.
2. 2-step HDI Laser Blind Buried Via PCB;
3. Outer Final Copper Thickness: 1OZ,
Inner Final Copper Thickness: 0.5OZ;
4. The surface finished of the BGA area is OSP,
and the surface finished of the remaining areas is ENIG.
Layer: 8L
Base Material: FR4 TG150
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+OSP+Impedance control
Unit Size(mm): 65.00*50.00
Min. W/S(mil): 3/3