Description
Special Request:
Solder Mask Ink Model: H-9100 8G,
Solder Mask Thickness≥10um.
Layer: 4L
Base Material: FR4 TG130, CTI≥250
Board Thickness: 1.55mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 102.24*107.32
Min. W/S(mil): 6/7.87
Min. Hole Size: 0.2mm