Description
Special Request:
Some parts of the via holes are plugged with solder mask ink,
some parts are opened solder mask on both sides,
some parts are plugged via with resin+filling.
Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 60.00*29.00
Min. W/S(mil): 8/6
Min. Hole Size: 0.3mm
Solder Mask: Black