Description
Special Request:
1. Ball pad;
2. Laser barcode;
3. Holes＞0.2mm need to be plugged with resin+filling.
Layer: 4L
Base Material: FR4 TG150
Board Thickness: 0.9+/-0.1mm
Outer Layer Final Copper Thickness: 1OZ
Inner Layer Final Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 65.32*41.77
Min. W/S(mil): 3/4
Min. Hole Size: 0.2mm