Description
HDI Laser Blind Buried Via Board
Special Request: BGA
Layer: 6L
Base Material: FR4 TG135
Board Thickness: 1.55mm±0.2mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 96.00*72.00
Min W/S(mil): 5.9/6
Min Hole Size: 0.2mm